At Computex 2026, Foxconn (Hon Hai) showcased its advanced infrastructure capabilities designed for the next generation of AI computing. The exhibit highlighted a comprehensive suite of hardware solutions, notably focusing on liquid cooling technologies (including quick disconnects and various manifolds) and power distribution components like AC whips, specifically engineered to support Nvidia’s Vera Rubin NVL72 and NVL8 rack architectures. Additionally, the display featured high-performance networking and computing hardware, such as the Nvidia Spectrum-X SN6600 Ethernet switch, GB2281A AI accelerators (featuring AMD MI355), and advancements in silicon photonics and optical transceivers.
Silicon Photonics:
Optical Transceiver
Live demo
CPO ELSFP
Liquid Cooling Quick Disconnect
AC Whip
Nvidia MGX Components for Vera Rubin NVL72
Liquid Cooling Switch
Nvidia Vera Rubin NVL72 Rack Manifold
NVL8 Coldplate for CPU & DIMM, Switch Manifold, Coldplate for E1.S
Foxconn cold-plate assembly; exhibit label: “Coldplate for Connext-X®9”
NVL72 Inner Manifold
GB2281A (AI Accelerator with AMD MI355)
Nvidia Spectrum-X SN6600 Ethernet Switch
XPO & CPC — ChipLink 448G
Nvidia HGX Rubin NVL8 GPU Tray
Nvidia HGX Vera CPU
Higher resolution full video:
Updated Oct 16, 2026