Auras at Computex 2026

Cold Plate Module

Auras’ Computex 2026 exhibit connected three levels of liquid cooling: cold plates at the chip, manifolds and CDUs around the rack, and equipment for coolant refilling and leak detection. Seeing these together makes a practical point: installing the heat-transfer hardware is only part of operating a cooling loop. Filling, connecting, and maintaining that loop also require equipment. The photographs document the exhibits, not field reliability tests.

Next-Gen AI & GPU Cooling: Auras featured specialized cooling components for cutting-edge AI architectures, including Cold Plate Modules for Nvidia’s upcoming Vera Rubin NVL72 and GB300 NVL72, as well as cold plates and switch manifolds for the HGX B300 and HGX Rubin NVL8 (covering CPU, GPU, and DIMM). They also supported AMD’s ecosystem with the AMD MI355 Cold Plate Module.
Server Rack & Infrastructure Solutions: To manage liquid flow at scale, they introduced the Rack manifold for Nvidia Vera Rubin NVL72, an AI Rack manifold, and an In-row CDU (Coolant Distribution Unit), alongside essential components like MQD & UQD (Multi/Universal Quick Disconnects) and Power Shelves.
Smart Maintenance & Safety: Highlighting data center reliability, Auras demonstrated a Smart Refilling Robot for automated coolant management and advanced Leak detection systems to prevent hardware damage.
CPU & Consumer/AIO Cooling: For mainstream and next-gen processors, they displayed Intel Next-Gen CPU and AMD SP7/SP8 solutions, featuring both custom Cold Plate Modules and robust AIO (All-In-One) Cooling Modules integrated with high-performance pumps.